FAN7711N

Electronic Ballast Control IC

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K FAN7711
Family Code	0SB
Package Type	DIP
Package Description	008,PLASTIC, MOLDED DIP
Pin Count	8
FIT	6.6
Maximum Reflow Temperature	NA (thru hole)
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Iron,Zinc,Phosphorus,Silver
Lead Pitch	2540
Minimum Lead Spacing	760
Die Fabrication
Fabrication Process Identifier	HDG4
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	100	°C/Watt
Thermal Impedance (Theta JC)	36	°C/Watt
Moisture Sensitivity	NA
Electrical Test
ESD Human Body Model (HBM)	1000	V
ESD Charged Device Model (CDM)	500	V
ESD Machine Model (MM)	300	V

*If an attribute is listed twice, either can be used on the part.