| General Information |
| Device Marking(TOP MARK) | $Y&Z&E&3
FCB
11N60F
| |
| Family Code | 0SQ | |
| Package Type | TO-263(D2PAK) | |
| Package Description | ADDED FOR DPP(INTERSIL) PKG ID CHANGE | |
| Pin Count | 2 | |
| FIT | 12.9 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 63 | °C/Watt |
| Thermal Impedance (Theta JC) | 1 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 2000 | V |
| ESD Machine Model (MM) | 200 | V |
| Package Assembly* |
|
|
| UL Flammability Rating | PDD | |
| DAP Size | 246*190MILS | |
| Frame Material | L-BEND | |
| Wire Material | AL | |
| Wire Diameter | 6.0 MIL | |
| Wire Material | AL | |
| Wire Diameter | 12.0 MIL | |
