|  |
| General Information | | Device Marking(TOP MARK) | $Y&Z&E&3
FCB
11N60
| | | Family Code | 0SQ | | | Package Type | TO-263(D2PAK) | | | Package Description | ADDED FOR DPP(INTERSIL) PKG ID CHANGE | | | Pin Count | 2 | | | FIT | 12.9 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 999 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | 1 | | |
|
| UL Flammability Rating | PDD | | | Wire Material | AL | | | Wire Diameter | 6.0 MIL | | | Wire Material | AL | | | Wire Diameter | 12.0 MIL | | | DAP Size | 246*190MILS | | | Frame Material | L-BEND | |
*If an attribute is listed twice, either can be used on the part.
back to top
|
