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| General Information | | Device Marking(TOP MARK) | $Y&Z&E&3
FDA
20N50
| | | Family Code | 0SQ | | | Package Type | TT3P0 | | | Package Description | MOLDED PACKAGE, TT-3P,3LDS | | | Pin Count | 3 | | | FIT | 12.9 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 63 | °C/Watt | | Thermal Impedance (Theta JC) | 1 | °C/Watt | | Moisture Sensitivity | NA | | | Electrical Test | | ESD Human Body Model (HBM) | 2000 | V | | ESD Machine Model (MM) | 200 | V | | Package Assembly* | |
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| UL Flammability Rating | TO3P | | | Wire Material | AL | | | Wire Diameter | 5.0 MIL | | | Wire Material | AL | | | Wire Diameter | 15.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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