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| General Information | | Device Marking(TOP MARK) | $Y&Z&E&3
FDB
12N50
| | | Family Code | 0SQ | | | Package Type | TO-263(D2PAK) | | | Package Description | 002, PLASTIC MOLDED, TO-263 PKG, CNTR LD CUT, SMD (45) | | | Pin Count | 2 | | | Die Size X | 3860 | MLL | | Die Size Y | 3810 | MLL | | FIT | 12.9 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 62 | °C/Watt | | Thermal Impedance (Theta JC) | 1 | °C/Watt | | Moisture Sensitivity | 1 | | |
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| UL Flammability Rating | PDD | | | Wire Material | AL | | | Wire Diameter | 12.0 MIL | | | DAP Size | 246*190MILS | | | Frame Material | L-BEND | | | Wire Material | AL | | | Wire Diameter | 5.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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