FDB5800

60V N-Channel Logic Level PowerTrench® MOSFET

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K FDB 5800
Family Code	021
Package Type	TO-263(D2PAK)
Package Description	002, PLASTIC MOLDED, TO-263 PKG, CNTR LD CUT, SMD (45)
Pin Count	2
FIT	6.5
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper
Lead Pitch	2285
Minimum Lead Spacing	1145
Die Fabrication
Fabrication Process Identifier	83573LDJ
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
UL Flammability Rating	UL94-V0
Die Attach Type	Solder /92.5Pb
DAP Size	Redesign
Frame Material	12SNOFC

*If an attribute is listed twice, either can be used on the part.