FDB8443
40V N-Channel PowerTrench® MOSFET
Test Standards: - Moisture Sensitivity: 1
- Thermal Impedance: 1/43
- Physical Dimensions: TO-263(D2PAK)
- ESD CDM: 2000
| General Information | | Device Marking(TOP MARK) | $Y&Z&3&K
FDB
8443
| | | Family Code | 021 | | | Package Type | TO-263(D2PAK) | | | Package Description | 002, PLASTIC MOLDED, TO-263 PKG, CNTR LD CUT, SMD (45) | | | Pin Count | 2 | | | FIT | 6.5 | | | Maximum Reflow Temperature | 260C | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Base Metal/Leadframe Material | Copper | | | Lead Pitch | 2285 | | | Minimum Lead Spacing | 1145 | | | Die Fabrication | | Fabrication Process Identifier | 33468LLJ | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Thermal Impedance (Theta JA) | 43 | °C/Watt | | Thermal Impedance (Theta JC) | 1 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Charged Device Model (CDM) | 2000 | V | | Package Assembly* | |
|
| UL Flammability Rating | UL94-V0 | | | DAP Size | Redesign | | | Frame Material | 12SNOFC | | | Die Attach Type | Solder /92.5Pb | |
*If an attribute is listed twice, either can be used on the part.
|