| General Information |
| Device Marking(TOP MARK) | $Y&Z&3&K
FDB
8444TS
| |
| Family Code | 061 | |
| Package Type | TO-263(D2PAK) | |
| Package Description | 005, PLASTIC MOLDED, TO-263 PACKAGE | |
| Pin Count | 5 | |
| FIT | 6.5 | |
| Die Fabrication |
| Fabrication Process Identifier | 33466LTJ | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 43 | °C/Watt |
| Thermal Impedance (Theta JC) | 1 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | TBD | V |
| ESD Charged Device Model (CDM) | NA | V |
| ESD Machine Model (MM) | TBD | V |
| Package Assembly* |
| DAP Size | WITH-DIMPLE | |
| Frame Material | DPG | |
|
|
| UL Flammability Rating | DPG | |
| Wire Material | AL | |
| Wire Diameter | 15.0 MIL | |
| Wire Material | AL | |
| Wire Diameter | 5.0 MIL | |
