| General Information |
| Device Marking(TOP MARK) | $Y&Z&3&K
FDB
8870
| |
| Family Code | 054 | |
| Package Type | TO-263(D2PAK) | |
| Package Description | 002, PLASTIC MOLDED, TO-263 PKG, CNTR LD CUT, SMD (45) | |
| Pin Count | 2 | |
| FIT | 25.2 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper | |
| Lead Pitch | 2285 | |
| Minimum Lead Spacing | 1145 | |
| Die Fabrication |
| Fabrication Process Identifier | SACVA | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
|
|
| UL Flammability Rating | UL94-V0 | |
|
|
| UL Flammability Rating | PDD | |
| Wire Material | AL | |
| Wire Diameter | 15.0 MIL | |
| Wire Material | AL | |
| Wire Diameter | 5.0 MIL | |
| DAP Size | Redesign | |
| Frame Material | 12SNOFC | |
| DAP Size | 246*190MILS | |
| Frame Material | L-BEND | |
| Die Attach Type | Solder /92.5Pb | |
