FDC5614P

60V P-Channel Logic Level PowerTrench® MOSFET

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&Y .564
Family Code	02P
Package Description	006, PLASTIC MOLDED, SUPER SOT-6 PKG, SINGLE, SMD, CU WIRE
Die Fabrication
Fabrication Process Identifier	4EEEC
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Charged Device Model (CDM)	1500	V
Package Assembly*
DAP Size	1.98X1.19 MM
Frame Material	Alloy194

*If an attribute is listed twice, either can be used on the part.