| General Information |
| Device Marking(TOP MARK) | &E&Y
.020
| |
| Family Code | 05C | |
| Package Type | SSOT-6 FLMP | |
| Package Description | 006, PLASTIC MOLDED, SSOT-6, SMD, BOTTOMLESS | |
| Pin Count | 6 | |
| FIT | 28.2 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Nickel,Palladium,Gold | |
| Lead Pitch | 950 | |
| Minimum Lead Spacing | 450 | |
| Die Fabrication |
| Fabrication Process Identifier | HYBRID | |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Die Attach Type | Solder / 88Pb10Sn2Ag | |
|
|
| UL Flammability Rating | UL94-V0 | |
| Wire Material | Cu | |
| Wire Diameter | 1.5 MIL | |
| DAP Size | 1.54X1.45 MM/1.54X1.45 MM | |
| Frame Material | C194FH | |
