| General Information |
| Device Marking(TOP MARK) | &E&E&Y
.637Z
| |
| Family Code | 054 | |
| Package Type | SSOT-6 | |
| Package Description | 006, PLASTIC MOLDED, SUPER SOT-6 PKG, SINGLE, SMD (33) | |
| Pin Count | 6 | |
| FIT | 25.2 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Lead (RoHS Exempt),Silver | |
| Lead Pitch | 950 | |
| Minimum Lead Spacing | 450 | |
| Die Fabrication |
| Fabrication Process Identifier | SNBMN | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 78 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 3200 | V |
| ESD Charged Device Model (CDM) | 1500 | V |
| ESD Machine Model (MM) | 200 | V |
| Package Assembly* |
| DAP Size | 1.98X1.19 MM | |
| Frame Material | Alloy194 | |
