| General Information |
| Device Marking(TOP MARK) | $Y&Z&3&K
FDD
8424H
| |
| Family Code | 057 | |
| Package Type | TO-252(DPAK) | |
| Package Description | 005, PLASTIC MOLDED, TO-252 DPAK PKG, SMD | |
| Pin Count | 5 | |
| FIT | 10.7 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 40 | °C/Watt |
| Thermal Impedance (Theta JC) | 2 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 500 | V |
| ESD Machine Model (MM) | 160 | V |