| General Information |
| Device Marking(TOP MARK) | $Y&Z&3&K
FDD
8444L
| |
| Family Code | 061 | |
| Package Type | TO-252(DPAK) | |
| Package Description | 002, MOLDED PACKAGE, TO-252 2 LDS. SMD | |
| Pin Count | 2 | |
| FIT | 6.5 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Silver | |
| Lead Pitch | 2290 | |
| Minimum Lead Spacing | 1150 | |
| Die Fabrication |
| Fabrication Process Identifier | 31461LLJ | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 52 | °C/Watt |
| Thermal Impedance (Theta JC) | 1 | °C/Watt |
| Moisture Sensitivity | 1 | |
| DAP Size | 5.08X3.74 MM | |
| Frame Material | 12SnOFC | |
|
|
| UL Flammability Rating | 16MM*8.5G | |
| Wire Material | AL | |
| Wire Diameter | 5.0 MIL | |
| Wire Material | Al/Ni | |
| Wire Diameter | 12.0 MIL | |
| Die Attach Type | Solder /92.5Pb | |
