FDD8896

30V N-Channel PowerTrench®MOSFET

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K FDD 8896
Family Code	054
Package Description	002, MOLDED PACKAGE, TO-252 2 LDS. SMD
FIT	25.2
Die Fabrication
Fabrication Process Identifier	33347LFJ
Package Assembly*
Thermal Impedance (Theta JA)	100	°C/Watt
Thermal Impedance (Theta JC)	2	°C/Watt
Moisture Sensitivity	1
DAP Size	5.08X3.74 MM
Frame Material	12SnOFC
UL Flammability Rating	16MM*8.5G
Die Attach Type	Solder /92.5Pb

*If an attribute is listed twice, either can be used on the part.