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| General Information | | Device Marking(TOP MARK) | &E&Y
&ON28&C
&.&O&V
| | | Family Code | 05C | | | Package Type | MicroFET | | | Package Description | 6LD,MLP,DUAL,NON-JEDEC,2MM SQUARE,DUAL DAP | | | Pin Count | 6 | | | FIT | 28.2 | | | Die Fabrication | | Fabrication Process Identifier | HYBRID | | | Package Assembly* | | Thermal Impedance (Theta JA) | 86 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 2400 | V | | ESD Machine Model (MM) | 150 | V | | Package Assembly* | | DAP Size | 6L | | | Frame Material | 1.060X0.775MM | | | Die Attach Type | Epoxy / QMI 519 | | | Wire Material | Au | | | Wire Diameter | 1.5 MIL | |
*If an attribute is listed twice, either can be used on the part.
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