| General Information |
| Device Marking(TOP MARK) | &E&Y
&O857&C
&.&O&V
| |
| Family Code | 05C | |
| Package Type | MicroFET | |
| Package Description | 6LD,MLP,DUAL,NON-JEDEC,2MM SQUARE,DUAL DAP | |
| Pin Count | 6 | |
| FIT | 28.2 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 86 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 200 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 50 | V |
| Package Assembly* |
| DAP Size | 6L | |
| Frame Material | 1.060X0.775MM | |
| Wire Material | Au | |
| Wire Diameter | 1.5 MIL | |
| Die Attach Type | Epoxy / QMI 519 | |
