FDFMA2P859T

-20V Integrated P-Channel PowerTrench® MOSFET and Schottky Diode

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&Y &O859&C &.&O&V
Family Code	05C
Package Description	6LD,UMLP,DUAL,NON-JEDEC,2MM SQUARE,DUAL DAP, 0.55MM MAX
FIT	28.2
Die Fabrication
Fabrication Process Identifier	SEE SPEC REV
Package Assembly*
Thermal Impedance (Theta JA)	86	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	200	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
Wire Material	Au
Wire Diameter	1.5 MIL
DAP Size	6L
Frame Material	0.81X1.12MM
Die Attach Type	Epoxy / 8008-HT

*If an attribute is listed twice, either can be used on the part.