FDFMA3N109

30V Integrated N-Channel PowerTrench®MOSFET and Schottky Diode

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&Y &O109&C &.&O&V
Family Code	05C
Package Description	6LD,MLP,DUAL,NON-JEDEC,2MM SQUARE,DUAL DAP
FIT	28.2
Die Fabrication
Fabrication Process Identifier	HYBRID
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	1800	V
ESD Charged Device Model (CDM)	2000	V
ESD Machine Model (MM)	100	V
Package Assembly*
DAP Size	6L
Frame Material	1.060X0.775MM
Die Attach Type	Epoxy / QMI 519
Wire Material	Au
Wire Diameter	1.5 MIL

*If an attribute is listed twice, either can be used on the part.