FDFME3N311ZT

30V Integrated N-Channel PowerTrench® MOSFET and Schottky Diode

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&Y &O1T&C &.&O&V
Family Code	05C
Package Description	ULTRA MLP 1.6X1.6 6L 0.55MM MAX THK, 0.50MM PITCH, DUAL DAP
FIT	28.2
Die Fabrication
Fabrication Process Identifier	SEE SPEC REV
Package Assembly*
Thermal Impedance (Theta JA)	110	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	1600	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
DAP Size	6L
Frame Material	0.613X0.86MM(2X)
Wire Material	Au
Wire Diameter	1.3 MIL
Die Attach Type	Epoxy / 8008-HT

*If an attribute is listed twice, either can be used on the part.