FDG6331L

Integrated Load Switch

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&Y .31
Family Code	05C
Package Description	006, PLASTIC MOLDED SC70-6 LEAD PACKAGE, SMD
FIT	28.2
Die Fabrication
Fabrication Process Identifier	HYBRID
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
DAP Size	43X2 MIL
Frame Material	A42HH

*If an attribute is listed twice, either can be used on the part.