| General Information |
| Device Marking(TOP MARK) | $Y&Z&3&K
FDI
8441
| |
| Family Code | 021 | |
| Package Type | TO-262(I2PAK) | |
| Package Description | ADDED FOR DPP(INTERSIL) PKG ID CHANGE | |
| Pin Count | 3 | |
| FIT | 6.5 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Sn | |
| Die Fabrication |
| Fabrication Process Identifier | 33477LLJ | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 62 | °C/Watt |
| Thermal Impedance (Theta JC) | 1 | °C/Watt |
| Moisture Sensitivity | NA | |
|
|
| UL Flammability Rating | UL94-V0 | |
| Die Attach Type | Solder /92.5Pb | |
| DAP Size | Redesign | |
| Frame Material | 12SNOFC | |
