FDMC7570S

25V N-Channel Power Trench® SyncFET™

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K FDMC 7570S
Family Code	054
Package Description	8LD,PQFN,DUAL,JEDEC MO-229 VEEC, 3.3X3.3MM SINGLE TIED DAP
FIT	25.2
Die Fabrication
Fabrication Process Identifier	QN7OF
Package Assembly*
Thermal Impedance (Theta JA)	53	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	1400	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
Die Attach Type	Solder / 92.5Pb5Sn2.5Ag
DAP Size	2.667X2.032 MM
Frame Material	C194
Die Attach Type	Solder / 92.5Pb5Sn2.5Ag
DAP Size	2.72X2.85X0.254 MM
Frame Material	C194

*If an attribute is listed twice, either can be used on the part.