| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FDMC
8854
| |
| Family Code | 054 | |
| Package Type | Power 33 | |
| Package Description | 8 LDS,MLP,JEDEC MO-220,3.3 MM SQUARE,0.9 MM HT. | |
| Pin Count | 8 | |
| FIT | 25.2 | |
| Die Fabrication |
| Fabrication Process Identifier | DWCVA | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 60 | °C/Watt |
| Thermal Impedance (Theta JC) | 3 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 800 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 450 | V |