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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
FDMC
8854
| | | Family Code | 054 | | | Package Type | Power 33 | | | Package Description | 8 LDS,MLP,JEDEC MO-220,3.3 MM SQUARE,0.9 MM HT. | | | Pin Count | 8 | | | FIT | 25.2 | | | Die Fabrication | | Fabrication Process Identifier | DWCVA | | | Package Assembly* | | Thermal Impedance (Theta JA) | 60 | °C/Watt | | Thermal Impedance (Theta JC) | 3 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 1450 | V | | ESD Machine Model (MM) | 450 | V |
*If an attribute is listed twice, either can be used on the part.
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