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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&T
FDMF6700
| | | Family Code | 05Q | | | Package Type | Power 66 | | | Package Description | 40LD, MLP, JEDEC MO-220, QUAD, 6MM SQUARE | | | Pin Count | 40 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 999 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | 3 | | | DAP Size | 40L | | | Frame Material | 2.32X2/2.67X1.82/4.9X2.4 | | | Die Attach Type | Epoxy / EN-4620K | | | Wire Material | Au | | | Wire Diameter | 1.3 MIL | | | Wire Material | Au | | | Wire Diameter | 2.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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