FDMF6704

XS™ DrMOS - Extra-Small, High-Performance, High-Frequency DrMOS Module

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K FDMF6704_1
Family Code	096
Package Description	40LD, MLP, QUAD, NON JEDEC, 6X6MM, TRIPLE DAP
FIT	16.9
Die Fabrication
Fabrication Process Identifier	SEE SPEC REV
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	3
Electrical Test
ESD Human Body Model (HBM)	2500	V
ESD Charged Device Model (CDM)	1000	V
Package Assembly*
DAP Size	40L
Frame Material	2.67X1.77/2.27X1.77/4.7X2.71MM
Die Attach Type	Epoxy / QMI 519
Wire Material	Au
Wire Diameter	1.0 MIL
Wire Material	Cu
Wire Diameter	2.0 MIL

*If an attribute is listed twice, either can be used on the part.