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Driver plus FET Multi-chip Module
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Qualification Data
Fairchild Product Reliability Report
Contact your regional quality
and reliability
representative with any questions on product qualification support.
Test Standards: - Moisture Sensitivity: 3
- Thermal Impedance: 999/999
- Physical Dimensions: Power 88
- ESD HBM: TBD
- ESD CDM: NA
- ESD MM: TBD
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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&T
FDMF8700
| | | Family Code | 05Q | | | Package Type | Power 88 | | | Package Description | 56LD, MLP, QUAD, JEDEC MO-220, VAR WLLD, 8X8MM, TRIPLE DAP | | | Pin Count | 56 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 999 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | 3 | | | Electrical Test | | ESD Human Body Model (HBM) | TBD | V | | ESD Charged Device Model (CDM) | NA | V | | ESD Machine Model (MM) | TBD | V | | Package Assembly* | | DAP Size | 56L.0.5P | | | Frame Material | 3 Dap | | | Wire Material | Au | | | Wire Diameter | 2.0 MIL | | | Wire Material | Au | | | Wire Diameter | 1.3 MIL | | | Die Attach Type | Epoxy / EN-4620K | |
*If an attribute is listed twice, either can be used on the part.
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