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FDMF8704V
High Efficiency / High Frequency FET plus Driver Multi-chip Module with Internal Voltage Regulator

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Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: 3
  • Thermal Impedance: 999/999
  • Physical Dimensions: Power 88
  • ESD HBM: 1500
  • ESD CDM: 2000
  • ESD MM: 600

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AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&2&T
FDMF8704V
 
Family Code05Q 
Package TypePower 88 
Package Description56LD, MLP, QUAD, JEDEC MO-220, VAR WLLD, 8X8MM, TRIPLE DAP 
Pin Count56 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)999°C/Watt
Thermal Impedance (Theta JC)999°C/Watt
Moisture Sensitivity3 
Electrical Test
ESD Human Body Model (HBM)1500V
ESD Charged Device Model (CDM)2000V
ESD Machine Model (MM)600V
Package Assembly*
DAP Size56L.0.5P 
Frame Material3 Dap 
Die Attach TypeEpoxy / QMI 519 
Wire MaterialAu 
Wire Diameter2.0 MIL 
Wire MaterialAu 
Wire Diameter1.3 MIL 

*If an attribute is listed twice, either can be used on the part.

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