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Dual Integrated Solenoid Driver. (Transferred to alternate site. Please contact local reps for details)
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Qualification Data
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This pagePrint version
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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
FDMS2380
&R
| | | Family Code | 06X | | | Package Type | PQFN 8x12 | | | Package Description | 18LD,MLP,DISD MODULE,TRIPLE DAP, 8X12MM | | | Pin Count | 18 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 999 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | 3 | | | Electrical Test | | ESD Human Body Model (HBM) | 1 | V | | ESD Machine Model (MM) | 200 | V |
*If an attribute is listed twice, either can be used on the part.
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