FDMS7570S

25V N-Channel PowerTrench® SyncFET™

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K FDMS 7570S
Family Code	054
Package Description	8LD, PQFN, JEDEC MO-240 AA, 5.0 X 6.0 MM (CLIPBOND VERSION)
FIT	25.2
Die Fabrication
Fabrication Process Identifier	QN7OF
Package Assembly*
Thermal Impedance (Theta JA)	50	°C/Watt
Thermal Impedance (Theta JC)	2	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	1400	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
Die Attach Type	Solder / 92.5Pb5Sn2.5Ag
Die Attach Type	Solder / 92.5Pb5Sn2.5Ag
DAP Size	4.2X3.5 MM
Frame Material	A194
DAP Size	8L
Frame Material	3.90X3.75X0.254 MM

*If an attribute is listed twice, either can be used on the part.