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| General Information | | Device Marking(TOP MARK) | $Y&Z&3&K
FDMS
8670AS
| | | Family Code | 054 | | | Package Type | Power 56 (PQFN) | | | Package Description | 8LD,PQFN,DUAL,NON-JEDEC,5X6MM,SINGLE TIED DAP | | | Pin Count | 8 | | | FIT | 25.2 | | | Die Fabrication | | Fabrication Process Identifier | PJCVNS | | | Package Assembly* | | Thermal Impedance (Theta JA) | 50 | °C/Watt | | Thermal Impedance (Theta JC) | 2 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 1600 | V | | ESD Machine Model (MM) | 400 | V | | Package Assembly* | | Wire Material | Al | | | Wire Diameter | 40X6 MIL | | | Wire Material | AL | | | Wire Diameter | 5.0 MIL | | | DAP Size | 4.42X3.886 MM | | | Frame Material | A194 | |
*If an attribute is listed twice, either can be used on the part.
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