| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FDS
7764A
| |
| Family Code | 054 | |
| Package Type | WIRELESS SOIC | |
| Package Description | 008, PLASTIC MOLDED, SOIC-8 WIRELESS, NARROW BODY | |
| Pin Count | 8 | |
| FIT | 25.2 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper, Iron, Zinc, Phosphorus, Silver | |
| Die Fabrication |
| Fabrication Process Identifier | 7OCDW | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Die Attach Type | Solder / 88Pb10Sn2Ag | |
|
|
| UL Flammability Rating | UL94-V0 | |
| Die Attach Type | Solder / 85Pb10Sb5Sn | |
| DAP Size | 2.24X3.70 MM | |
| Frame Material | C194SH | |
| DAP Size | 2.64X3.73 MM | |
| Frame Material | C194 | |
