FDS8672S

30V N-Channel PowerTrench® SyncFET™

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K FDS 8672S
Family Code	02P
Package Description	008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD, CU WIRE
Die Fabrication
Fabrication Process Identifier	PQCVNS
Package Assembly*
Thermal Impedance (Theta JA)	50	°C/Watt
Thermal Impedance (Theta JC)	25	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	1100	V
ESD Charged Device Model (CDM)	2000	V
ESD Machine Model (MM)	300	V
Package Assembly*
DAP Size	4.318X2.794MM
Frame Material	Single Dap
Die Attach Type	Epoxy / QMI 519

*If an attribute is listed twice, either can be used on the part.