| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FDS
8813NZ
| |
| Family Code | 054 | |
| Package Type | SOIC | |
| Package Description | 008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1) | |
| Pin Count | 8 | |
| FIT | 25.2 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver | |
| Lead Pitch | 1270 | |
| Minimum Lead Spacing | 760 | |
| Die Fabrication |
| Fabrication Process Identifier | SOCWN | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 50 | °C/Watt |
| Thermal Impedance (Theta JC) | 25 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 5600 | V |
| ESD Machine Model (MM) | 800 | V |
| Package Assembly* |
| Die Attach Type | Epoxy / 84-1LMISR4 | |
| DAP Size | 4.12X2.79 | |
| Frame Material | Cu | |
|
|
| UL Flammability Rating | UL94-V0 | |
| Wire Material | Au | |
| Wire Diameter | 2.0 MIL | |
