| General Information |
| Device Marking(TOP MARK) | $Y&Z&3&K
FDU
8770
| |
| Family Code | 054 | |
| Package Type | TO-251(IPAK) | |
| Package Description | 003, PLASTIC MOLDED, TO-251 IPAK PKG, THRU-HOLE (39) | |
| Pin Count | 3 | |
| FIT | 25.2 | |
| MSL Rating | | | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Die Fabrication |
| Fabrication Process Identifier | 33250LFJ | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 52 | °C/Watt |
| Thermal Impedance (Theta JC) | 2 | °C/Watt |
| Moisture Sensitivity | NA | |