| General Information |
| Device Marking(TOP MARK) | &Y
&E2&G
&.
| |
| Family Code | 05C | |
| Package Type | 1.0x1.5 WL-CSP | |
| Package Description | 6-BALL, WL-CSP, 1.0 X 1.5MM | |
| Pin Count | 6 | |
| FIT | 28.2 | |
| Die Fabrication |
| Fabrication Process Identifier | ADBLW | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 83 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 480 | V |
| ESD Machine Model (MM) | 90 | V |