| General Information |
| Device Marking(TOP MARK) | &Y
.AB
| |
| Family Code | 055 | |
| Package Type | SC70-6 | |
| Package Description | 006, PLASTIC MOLDED SC70-6 LEAD PACKAGE, SMD | |
| Pin Count | 6 | |
| FIT | 2.7 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Iron Nickel | |
| Lead Pitch | 650 | |
| Minimum Lead Spacing | 350 | |
| Die Fabrication |
| Fabrication Process Identifier | HYBRID | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
|
|
| UL Flammability Rating | UL94-V0 | |
| DAP Size | 30X17.5 MIL | |
| Frame Material | A42HH | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
