FFB5551

NPN Multi-Chip General Purpose Amplifier

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&E&E. &Y .P1
Family Code	055
Package Type	SC70
Package Description	006, PLASTIC MOLDED SC70-6 LEAD PACKAGE, SMD
Pin Count	6
FIT	2.7
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Iron,Nickel,Manganese,Cobalt,Silicon,Silver
Die Fabrication
Fabrication Process Identifier	DB5551X
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1

*If an attribute is listed twice, either can be used on the part.