| General Information |
| Device Marking(TOP MARK) | $Y&Z&E&3
FGA15N120
ANTD
| |
| Family Code | 0S4 | |
| Package Type | TO-3P | |
| Package Description | 3LD PLAS EXPOSED HEAT SINK | |
| Pin Count | 3 | |
| FIT | 133 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Silver | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 18um | |
| Thermal Impedance (Theta JA) | 40 | °C/Watt |
| Thermal Impedance (Theta JC) | 1 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Human Body Model (HBM) | 2000 | V |
| ESD Machine Model (MM) | 200 | V |
| Package Assembly* |
|
|
| Wire Material | AL | |
| Wire Diameter | 6.0 MIL | |
| Wire Material | AL | |
| Wire Diameter | 15.0 MIL | |
