| General Information |
| Device Marking(TOP MARK) | $Y&Z&E&3
FGA20N120
FTD
| |
| Family Code | 0S4 | |
| Package Type | TT3P0 | |
| Package Description | MOLDED PACKAGE, TT-3P,3LDS | |
| Pin Count | 3 | |
| FIT | 133 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 40 | °C/Watt |
| Thermal Impedance (Theta JC) | 1 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Human Body Model (HBM) | TBD | V |
| ESD Charged Device Model (CDM) | NA | V |
| ESD Machine Model (MM) | TBD | V |
| Package Assembly* |
| Wire Material | AL | |
| Wire Diameter | 6.0 MIL | |
| Wire Material | AL | |
| Wire Diameter | 15.0 MIL | |
|
|
| UL Flammability Rating | TO3P | |
