FGA50N100BNTTU

1000V, 50A NPT-Trench IGBT CO-PAK

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K FGA50N100 BNT
Family Code	0S4
Package Type	TO-3PN
Package Description	MOLDED PACKAGE, TT-3P,3LDS
Pin Count	3
FIT	133
Die Fabrication
Fabrication Process Identifier	SEE SPEC REV
Package Assembly*
Thermal Impedance (Theta JA)	40	°C/Watt
Thermal Impedance (Theta JC)	1	°C/Watt
Moisture Sensitivity	NA
Electrical Test
ESD Human Body Model (HBM)	5200	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
Wire Material	AL
Wire Diameter	20.0 MIL
Wire Material	AL
Wire Diameter	6.0 MIL

*If an attribute is listed twice, either can be used on the part.