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FGA70N30TDTU
300V PDP IGBT

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Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 1/40
  • Physical Dimensions: TO-3PN
  • ESD HBM: 3000

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AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
FGA70N30
TD
 
Family Code0S4 
Package TypeTO-3PN 
Package DescriptionMOLDED PACKAGE, TT-3P,3LDS 
Pin Count3 
FIT133 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Thermal Impedance (Theta JA)40°C/Watt
Thermal Impedance (Theta JC)1°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)3000V
Package Assembly*
Wire MaterialAL 
Wire Diameter15.0 MIL 
Wire MaterialAL 
Wire Diameter6.0 MIL 

*If an attribute is listed twice, either can be used on the part.

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