FGD3N60LSDTM

600V IGBT for HID Application

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K FGD 3N60LSD
Family Code	0F3
Package Type	TO-252(DPAK)
Package Description	002, MOLDED PACKAGE, TO-252 2 LDS. SMD
Pin Count	2
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Die Fabrication
Fabrication Process Identifier	SEE SPEC REV
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	100	°C/Watt
Thermal Impedance (Theta JC)	3	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Charged Device Model (CDM)	1500	V
Package Assembly*
DAP Size	5.08X3.74 MM
Frame Material	12SnOFC
UL Flammability Rating	16MM*8.5G
Die Attach Type	Solder /92.5Pb

*If an attribute is listed twice, either can be used on the part.