| General Information |
| Device Marking(TOP MARK) | &E&E&Y
&OFN01&C
&.&O&E&V
| |
| Family Code | 0M8 | |
| Package Type | SOT-23 | |
| Package Description | 005, PLASTIC MOLDED SOT23-5 LEAD PKG, SMD | |
| Pin Count | 5 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Lead (RoHS Exempt) | |
| Lead Pitch | 950 | |
| Minimum Lead Spacing | 450 | |
| Die Fabrication |
| Fabrication Process Identifier | TBD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 7500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 500 | V |
| Package Assembly* |
|
|
| UL Flammability Rating | UL94-V0 | |
| DAP Size | 52X43 MIL | |
| Frame Material | A194FH | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
