FIN1031MX

3.3V LVDS 4-Bit High Speed Differential Driver


Qualification Data

 Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: SOIC
  • ESD HBM: 8000
  • ESD CDM: 2000
  • ESD MM: 600


AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&2&K
FIN1031
 
Family Code0RF 
Package TypeSOIC 
Package Description016, PLASTIC MOLDED SOIC-16 LD PKG, NARROW BODY, SMD 
Pin Count16 
Maximum Reflow Temperature260C 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Base Metal/Leadframe MaterialCopper,Iron,Zinc,Phosphorus,Silver 
Lead Pitch1270 
Minimum Lead Spacing760 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Moisture Sensitivity1 
Electrical Test
ESD Human Body Model (HBM)8000V
ESD Charged Device Model (CDM)2000V
ESD Machine Model (MM)600V
Package Assembly*
UL Flammability RatingUL94-V0 
DAP Size88X150 MIL 
Frame MaterialCu 
Wire MaterialAu 
Wire Diameter0.9 MIL 
Die Attach TypeEpoxy / Poly 6 

*If an attribute is listed twice, either can be used on the part.

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