FIN1104MTC

LVDS 4 Port High Speed Repeater

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K FIN1104
Family Code	0RF
Package Type	TSSOP
Package Description	024,PLASTIC, TSSOP 4.4MM W,.65MM PH,JEDEC
Pin Count	24
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Silver
Die Fabrication
Fabrication Process Identifier	TSMCLVD
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	7500	V
ESD Charged Device Model (CDM)	2000	V
ESD Machine Model (MM)	400	V
Package Assembly*
DAP Size	2.8 X 3.5
Frame Material	Mat
Die Attach Type	Epoxy / QMI 519
Wire Material	Au
Wire Diameter	0.9 MIL

*If an attribute is listed twice, either can be used on the part.