| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FIN1108
| |
| Family Code | 0M8 | |
| Package Type | TSSOP | |
| Package Description | 048,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC | |
| Pin Count | 48 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 2| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu (Penang); Matte Sn (ATP) | |
| Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Silver | |
| Lead Pitch | 500 | |
| Minimum Lead Spacing | 230 | |
| Die Fabrication |
| Fabrication Process Identifier | M88TSMCLVD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn | |
| Moisture Sensitivity | 2 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 7500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 300 | V |
| Package Assembly* |
| DAP Size | 3.0X4.5MM | |
| Frame Material | Cu | |
| Die Attach Type | Epoxy / QMI 519 | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
