FIN1215MTDX

LVDS 21-Bit Serializers/De-Serializers

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K FIN1215
Family Code	0RF
Package Type	TSSOP
Package Description	048,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC
Pin Count	48
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu (Penang); Matte Sn (ATP)
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Silver
Lead Pitch	500
Minimum Lead Spacing	230
Die Fabrication
Fabrication Process Identifier	TSMCLVD
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn
Thermal Impedance (Theta JA)	82	°C/Watt
Thermal Impedance (Theta JC)	12	°C/Watt
Moisture Sensitivity	2
Electrical Test
ESD Human Body Model (HBM)	4500	V
ESD Charged Device Model (CDM)	400	V
ESD Machine Model (MM)	1000	V
Package Assembly*
Die Attach Type	Epoxy / QMI 519
DAP Size	3.0X4.5MM
Frame Material	Cu
Wire Material	Au
Wire Diameter	1.0 MIL

*If an attribute is listed twice, either can be used on the part.