| General Information |
| Device Marking(TOP MARK) | 2383
Y&3
|
| Family Code | 0S2 |
| Package Type | SOT-89 |
| Package Description | 3LD PLAS SM EXPOSED HEAT SINK |
| Pin Count | 3 |
| FIT | 4.2 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Silver |
| Die Fabrication |
| Fabrication Process Identifier | DB2383C |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 18um |
| Moisture Sensitivity | 1 |