FJD3305H1TM

NPN Silicon Transistor


Qualification Data

 Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: TO-252(DPAK)
  • ESD HBM: 8000
  • ESD CDM: 2000
  • ESD MM: 0


AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
J3305H1
 
Family Code0S3 
Package TypeTO-252(DPAK) 
Package Description002, MOLDED PACKAGE, TO-252 2 LDS. SMD 
Pin Count2 
FIT11.5 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Die Fabrication
Fabrication Process IdentifierDI3305A 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Moisture Sensitivity1 
Electrical Test
ESD Human Body Model (HBM)8000V
ESD Charged Device Model (CDM)2000V
Package Assembly*
UL Flammability RatingDPG 
Wire MaterialAL 
Wire Diameter6.0 MIL 

*If an attribute is listed twice, either can be used on the part.

Multilanguage - Chinese Multilanguage - English Multilanguage - Japanese Multilanguage - Korean
spacespace