FJD3305H1TM
NPN Silicon Transistor
Test Standards: - Moisture Sensitivity: 1
- Physical Dimensions: TO-252(DPAK)
- ESD HBM: 8000
- ESD CDM: 2000
- ESD MM: 0
| General Information | | Device Marking(TOP MARK) | $Y&Z&3&K
J3305H1
| | | Family Code | 0S3 | | | Package Type | TO-252(DPAK) | | | Package Description | 002, MOLDED PACKAGE, TO-252 2 LDS. SMD | | | Pin Count | 2 | | | FIT | 11.5 | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Die Fabrication | | Fabrication Process Identifier | DI3305A | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 8000 | V | | ESD Charged Device Model (CDM) | 2000 | V | | Package Assembly* | |
|
| UL Flammability Rating | DPG | | | Wire Material | AL | | | Wire Diameter | 6.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
|